JPH03101573U - - Google Patents
Info
- Publication number
- JPH03101573U JPH03101573U JP975290U JP975290U JPH03101573U JP H03101573 U JPH03101573 U JP H03101573U JP 975290 U JP975290 U JP 975290U JP 975290 U JP975290 U JP 975290U JP H03101573 U JPH03101573 U JP H03101573U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- solder
- dip treatment
- solder dip
- circuit components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP975290U JPH03101573U (en]) | 1990-02-02 | 1990-02-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP975290U JPH03101573U (en]) | 1990-02-02 | 1990-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101573U true JPH03101573U (en]) | 1991-10-23 |
Family
ID=31513340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP975290U Pending JPH03101573U (en]) | 1990-02-02 | 1990-02-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101573U (en]) |
-
1990
- 1990-02-02 JP JP975290U patent/JPH03101573U/ja active Pending